Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .
Features:
1.High conversion efficiency resulting in superior power output performance.
2.Outstanding power output even in low light or high temperature conditions
3.Optimized design for ease of soldering and lamination
4.Long-term stability,reliability and performance
5.Output power tolerance of +/-3%
Physical characteristics:
Dimension:156*156mm±0.5mm
Thickness:Wafer(si):200μm±20μm
Cell:240μm±40μm
Front:Silver bus bars;Dark blue/others silicon nitride anti reflection coating
Back:Silver/aluminum bus bars;Full-surface aluminum BSF
Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC
Electrical characteristics
| Efficiency code |
Efficiency(%) |
Pmax(w) |
Impp(A) |
Vmpp(V) |
Isc(A) |
Voc(V) |
| 1980 |
19.8 |
4.81 |
8.78 |
0.547 |
9.25 |
0.643 |
| 1970 |
19.7 |
4.78 |
8.76 |
0.546 |
9.24 |
0.643 |
| 1960 |
19.6 |
4.76 |
8.74 |
0.545 |
9.23 |
0.642 |
| 1950 |
19.5 |
4.74 |
8.72 |
0.544 |
9.22 |
0.642 |
| 1940 |
19.4 |
4.71 |
8.7 |
0.543 |
9.21 |
0.641 |
| 1930 |
19.3 |
4.69 |
8.68 |
0.541 |
9.19 |
0.640 |
| 1920 |
19.2 |
4.66 |
8.66 |
0.540 |
9.18 |
0.639 |
| 1910 |
19.1 |
4.64 |
8.65 |
0.538 |
9.17 |
0.639 |
| 1900 |
19.0 |
4.61 |
8.64 |
0.536 |
9.16 |
0.638 |
| 1890 |
18.9 |
4.59 |
8.63 |
0.534 |
9.15 |
0.637 |
| 1880 |
18.8 |
4.57 |
8.61 |
0.531 |
9.14 |
0.637 |
Solar Cell Production Line
Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight.
Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.
Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.
PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.
Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.
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